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Electronics Packing ESD Anti Static Barrier Bags Waterproof Recyclable OEM

Electronics Packing ESD Anti Static Barrier Bags Waterproof Recyclable OEM

esd anti static bags

esd barrier bags

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ISO9001/14001, IECC, CE RoHS

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Product Details
International Standard:
USA Standard:
ANSI/ESD S20.20-2007
CPP Material And Electronic Aluminum +pet Fabric
Resistance Value:
10^8-10^10 Ω Omega
Processing Technology:
Antistatic Material Mixed With Raw Materials
Anti-static Value:
Product Description

Electronics Packing ESD Anti Static Barrier Bags Waterproof Recyclable OEM


Static shielding bags provides properties intended to protect electronic devices and assemblies from Electrostatic Discharge(ESD) and to avoid charge accumulation on the bag that could be damaging to ESD susceptible devices and assemblies.


Static electricity is an objective natural phenomenon, and there are a variety of ways, such as contact, friction, peeling and so on. Electrostatic protection technology, such as electronic industry, semiconductor, petrochemical industry, steel industry, textile industry, rubber industry, aerospace and military field of electrostatic hazards, seeking to reduce the losses caused by static electricity.
Brief Introduction
Anti Static Bubble Bag
As packaging bag, Anti Static Bubble Bag,an anti-static bags, protect the products by conducting. According to “Faraday Cage” principle and compared with shielding bag, conductive packaging bag is dedicating to conduct and release the static effectively, preventing the products from static damages.
There are three production methods as following:
1. The mesh pattern is printed with black conductive ink on the anti-static plastic film.
2. Add conductive particles into raw materials, leading to the material can conduct static.
3. The final step is laminating a aluminum foil between two plastic materials.
Structure of Conductive Packaging Bag:
The Anti Static Bubble Bag that are made of conductive ink and particles, can be single layer or two layers. And if there is aluminum foil in the middle layer, the packaging bag has more than 2 layers, including two plastic layers and one metallic foil layer.
The principles of Anti Static Bubble Bag:
The conductive packaging bag with mesh pattern can be seen as a Faraday Cage to prevent the outside statics from the products in the packaging bag. At the same time, it also blocks electric charge in the packaging bag to keep the statics stable.
Technical Parameters:
The conductive packaging bag with metallic foil layer: its surface impedance is 103~105 Ω; while internal layer is anti-static and heat sealing PE or PP film with resistance: 108-1011Ω.
The application of conductive packaging bag is similar with shielding bag. They are widely used in the packaging of electric- sensitive electric appliance and electronic components, performing well in preventing the electric sensitive products from static damage in the outside. The conductive packaging material also can seen in the packaging of smart IC card,PCBA, computer’s accessories, smart phone, digital watches, sensor parts, MOS, CMOS, the accessory of FET and various equipment.
Data Sheet
Optional Materials: PE
Melting Point : 160~170℃
Working Temperature : -100°C~+100°C
Material Density : 0.925g/cm³
Common Size : 14.25" x 20" #7
Sample Color : Brown
Basic Material : Co-extruded
Protruding Characteristics : Security
Typical Application Industry : ESD
Shape Style : Hand Length Handle
Classification: Anti Static Bubble Bags
Materials introduction
The co extrusion film is applied to pure milk bags, express bags and metal protective films. It is characterized by good tensile properties and good surface brightness.
In the process of thin film, a kind of raw material is extruded into another kind of film which has been made, or the different kinds of films have been bonded together to form a multilayer film, which is called composite film. Most of the material of the composite film is plastic, but it can also be made of paper, metal foil (usually aluminum) or fabric. The basic requirement of composite film is good bonding between the layers to ensure the overall mechanical properties of the packaging.


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